Wiring circuit board, semiconductor device, method of manufacturing wiring circuit board, and method of manufacturing semiconductor device

A method of manufacturing a wiring circuit board, comprising the steps of:

• forming a through hole in a base material;
• forming a first inorganic adhesive layer made of an inorganic material on both surfaces of the base material and an inner peripheral surface of the through hole;
• forming a hollow through electrode in the through hole by laminating a first conductive layer made of a conductive material on the first inorganic adhesive layer;
• filling a filling resin composed of a mixture of a metallic powder and a resin material in the through electrode;
• thinning the first conductive layer laminated on both surfaces of the base material;
• forming a second conductive layer made of a conductive material to cover both ends of the first conductive layer in the through hole, covering upper and lower ends of the through electrode and forming a first wiring group;
• forming an insulative resin layer covering the first wiring group;
• forming a via hole in a portion of the insulative resin layer on the first wiring group;
• and,
• forming a second wiring group made of a conductive material and a conductive via hole in the insulative resin layer.

A method of manufacturing a wiring circuit board, comprising the steps of:

• forming a through hole in a base material;
• forming a first inorganic adhesive layer made of an inorganic material on both surfaces of the base material and an inner peripheral surface of the through hole;
• forming a hollow through electrode in the through hole by laminating a first conductive layer made of a conductive material on the first inorganic adhesive layer;
• filling a filling resin composed of a mixture of a metallic powder and a resin material in the through electrode;
• removing the first inorganic adhesive layer and the first conductive layer laminated on both surfaces of the base material;
• forming a second inorganic adhesive layer made of an inorganic material on both surfaces of the base material and the through electrode;
• forming a second conductive layer made of a conductive material on the second inorganic adhesive layer, covering upper and lower ends of the through electrode and forming a first wiring group;
• forming an insulative resin layer covering the first wiring group;
• forming a via hole in a portion of the insulative resin layer on the first wiring group;
• and,
• forming a second wiring group made of a conductive material and a conductive via in the insulative resin layer.