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US 2017/0250139 A1Published application
Alignment Mark Design for Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via.
Claims20
A method comprising:
- forming a first dielectric layer;
- performing a plating to form a metal post and an alignment mark over the first dielectric layer;
- encapsulating the metal post and the alignment mark in an encapsulating material;
- performing a planarization to reveal the metal post and the alignment mark;
- and
- forming a first plurality of redistribution lines electrically connecting to both the metal post and the alignment mark.
3 more elements
A method comprising:
- forming a first redistribution line and a second redistribution line;
- forming a metal post and an alignment mark over and electrically connected to the first redistribution line and the second redistribution line, respectively;
- encapsulating a device die, the metal post, and the alignment mark in an encapsulating material;
- performing a planarization on the encapsulating material to expose the metal post, the alignment mark, and conductive features of the device die;
- and
- forming a plurality of redistribution lines to electrically couple to the conductive features of the device die and the metal post.
3 more elements
A method comprising:
- forming a metal post and an alignment mark in a patterned photo resist;
- removing the patterned photo resist in which the metal post and the alignment mark are located;
- encapsulating a device die, the metal post, and the alignment mark in an encapsulating material;
- and
- forming a plurality of redistribution lines over the encapsulating material.
2 more elements
Dependencies are inferred from the claim text.