Systems and Methods for Microelectronics Fabrication and Packaging Using a Magnetic Polymer

A structure comprising:

• a semiconductor integrated circuit or an integrated passive device comprising a multilevel wiring network fabricated on a semiconductor die;
• and
• an inductor integrated into said multilevel wiring network, wherein said inductor comprises:
• a planar magnetic core;
• a conductive winding that turns around in a spiral manner on the outside of said magnetic core, said conductive winding including at least one level from said multilevel wiring network;
• and
• an insulation layer disposed between the magnetic core and the conductive winding, the insulation layer including a magnetic polymer, the magnetic polymer comprising:
• a polymer matrix;
• and
• a plurality of ferromagnetic particles disposed in the polymer matrix, the ferromagnetic particles having an average size of less than or equal to ten (10) microns.

A structure comprising:

• a semiconductor integrated circuit comprising a multilevel wiring network fabricated on a semiconductor die;
• an inductor integrated into said multilevel wiring network;
• a plurality of contacts in electrical communication with a top level of the multilevel wiring network;
• a substrate in electrical communication with the plurality of contacts;
• and
• a magnetic underfill epoxy disposed between the top level of the multilevel wiring network and the substrate, the magnetic underfill epoxy surrounding the contacts, the magnetic underfill epoxy including ferromagnetic particles,
• wherein the contacts, the substrate, and the magnetic underfill epoxy form a flip-chip attachment to the semiconductor die.

A structure comprising:

• an integrated passive device comprising a multilevel wiring network fabricated on a semiconductor die;
• an inductor integrated into said multilevel wiring network;
• a plurality of contacts in electrical communication with a top level of the multilevel wiring network;
• a substrate in electrical communication with the plurality of contacts;
• and
• a magnetic underfill epoxy disposed between the top level of the multilevel wiring network and the substrate, the magnetic underfill epoxy surrounding the contacts, the magnetic underfill epoxy including ferromagnetic particles,
• wherein the contacts, the substrate, and the magnetic underfill epoxy form a flip-chip attachment to the integrated passive device.

A method of fabricating a structure, the method comprising:

• disposing a plurality of ferromagnetic particles in an epoxy matrix to form a magnetic epoxy;
• mounting a package substrate on a plurality of contacts of a semiconductor integrated circuit or an integrated passive device, wherein the contacts define a gap between the substrate and the semiconductor integrated circuit or the integrated passive device, the semiconductor integrated circuit or the integrated passive device comprising a multilevel wiring network and an inductor, the inductor integrated into at least one level of the multilevel wiring network;
• flowing the magnetic epoxy into the gap, the magnetic epoxy surrounding the contacts;
• and
• curing the magnetic epoxy to adhere the substrate to the semiconductor integrated circuit or the integrated passive device.

A method comprising:

• integrating an inductor thereinto a multilevel wiring network of an integrated device, wherein said multilevel wiring network is arranged into wiring planes;
• forming said inductor from a planar magnetic core and a conductive winding, wherein said planar magnetic core has a principal plane;
• orienting said principal plane in parallel with said wiring planes;
• turning said conductive winding around in a spiral manner on the outside of said planar magnetic core;
• constructing said conductive winding piecewise of wire segments and of vertical interconnect accesses (VIAs), wherein said wire segments pertain to at least two of said wiring planes and said VIAs are interconnecting said at least two wiring planes;
• and
• disposing a magnetic polymer around said core, wherein the magnetic polymer forms an electrically insulating layer around said core.