Packaging Devices and Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho, Yi-Wen Wu
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Abstract
A method of manufacturing a packaging device may include: forming a plurality of through-substrate vias (TSVs) in a substrate, wherein each of the plurality of TSVs has a protruding portion extending away from a major surface of the substrate. A seed layer may be forming over the protruding portions of the plurality of TSVs, and a conductive ball may be coupled to the seed layer and the protruding portion of each of the plurality of TSVs. The seed layer and the protruding portion of each of the plurality of TSVs may extend into an interior region of the conductive ball.
Claims20
A packaging device, comprising:
- a substrate having a first major surface and a second major surface opposite the first major surface;
- a plurality of through-substrate vias (TSVs) within the substrate, the plurality of TSVs extending from the first major surface of the substrate;
- a redistribution layer at the second major surface of the substrate, the redistribution layer electrically coupled to the plurality of TSVs;
- a first semiconductor device disposed over and electrically coupled to the redistribution layer;
- and
- one first conductive element coupled to the plurality of TSVs, wherein the plurality of TSVs protrude into a portion of the one first conductive element.
A packaging device comprising:
- a substrate having a first major surface and a second major surface;
- a first plurality of conductive features, each extending linearly from the first major surface to the second major surface and protruding above the second major surface;
- a first conductive ball over the first plurality of conductive features, wherein the first plurality of conductive features each extends into the first conductive ball;
- a second plurality of conductive features, each extending linearly from the first major surface to the second major surface and protruding above the second major surface;
- and
- a second conductive ball over the second plurality of conductive features, wherein the second plurality of conductive features each extends into the second conductive ball.
A packaging device comprising:
- a substrate having a major surface extending in a first plane;
- a conductive structure in the substrate, the conductive structure comprising multiple conductors extending perpendicular to the first plane and extending from within the substrate to protrude above the major surface of the substrate;
- and
- a conductive ball electrically connected to the conductive structure, wherein the multiple conductors of the conductive structure all extend into an interior region of the conductive ball.
Dependencies are inferred from the claim text.