Electronic device comprising an encapsulating block locally of smaller thickness
AssigneeSTMicroelectronics (Grenoble 2) SAS
InventorsBenoit Besancon, Luc Petit
Life of this patent
Estimating the term…
Abstract
An electronic device includes a carrier substrate with at least one electronic-circuit chip mounted on a front face of the carrier substrate. An encapsulation block on the front face and embedding the electronic-circuit chip has a periphery with corners. The encapsulating block further has, in at least one local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the encapsulation block at least in a surrounding zone. The electronic device is manufactured by a process in which the zone of smaller thickness is obtained by molding or by machining.
Claims15
An electronic device, comprising:
- a carrier substrate,
- at least one integrated-circuit chip mounted on a front face of the carrier substrate, and
- a molded encapsulating block on the front face and in which said integrated-circuit chip is embedded, a periphery of said encapsulation block having corners, wherein the molded encapsulating block has, in at least one molded local zone located in at least one corner and from the front face of the carrier substrate, a smaller thickness than a thickness of the molded encapsulation block at least in a surrounding zone;
- and
- wherein said local zone having the smaller thickness is bounded by a front void in the molded encapsulating block separated from said surrounding zone by a shoulder.
(canceled)
7-10. (canceled)
An electronic device, comprising:
- a carrier substrate,
- an integrated-circuit chip mounted on a front face of the carrier substrate, and
- a molded block of material encapsulating the integrated-circuit chip on the front face, said molded block of material having a top surface and a peripheral side wall including a plurality of corners,
- wherein a thickness of the block of material is molded to be thinner at the peripheral side wall at each corner than at the peripheral side wall located between adjacent corners;
- and
- wherein said thinner thickness of the molded block of material defines a local zone that is bounded by a void in the top surface of the molded block of material, said void delimited by a shoulder.
(canceled)
Dependencies are inferred from the claim text.