Electrostatic chuck optimized for refurbishment
AssigneeApplied Materials, Inc.
InventorsVijay D. Parkhe, Kadthala Ramaya Narendrnath
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Abstract
A method of manufacturing an electrostatic chuck includes bonding an electrostatic puck to a metal base plate, wherein the electrostatic puck has an electrode embedded in the electrostatic puck. The method further includes subsequently polishing a surface of the electrostatic puck to a flatness of below 10 microns and an average surface roughness of approximately 2-6 micro-inches. The method further includes subsequently forming surface features on a surface of the electrostatic puck, the surface features comprising mesas and a sealing band around a perimeter of the electrostatic puck.
Claims20
A method of manufacturing an electrostatic chuck, comprising:
- bonding an electrostatic puck to a metal base plate, wherein the electrostatic puck has an electrode embedded in the electrostatic puck;
- subsequently polishing a surface of the electrostatic puck to a flatness of below 10 microns and an average surface roughness of approximately 2-6 micro-inches;
- and
- subsequently forming surface features on a surface of the electrostatic puck, the surface features comprising mesas and a sealing band around a perimeter of the electrostatic puck.
An electrostatic chuck comprising:
- a metal base plate;
- an electrostatic puck bonded to the metal base plate, wherein the electrostatic puck comprises an electrode embedded in the electrostatic puck, and wherein a surface of the electrostatic puck has a flatness of below 10 microns and an average surface roughness of approximately 2-6 micro-inches;
- and
- a plurality of surface features on a surface of the electrostatic puck, the plurality of surface features comprising mesas and a sealing band around a perimeter of the electrostatic puck.
Dependencies are inferred from the claim text.