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US 2017/0250098 A1Published application
Semiconductor processing device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYii-Cheng Lin, Chih-Ming Sun, Pinyen Lin
Life of this patent
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Abstract
A semiconductor processing device includes a first etching chamber, a second etching chamber, and an etching module. The etching module is adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching. A semiconductor process using the semiconductor processing device is also provided.
Claims20
A semiconductor processing device, comprising:
- a first etching chamber;
- a second etching chamber;
- and
- an etching module, adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching.
1 more element
A semiconductor processing device, comprising:
- a first etching chamber;
- a second etching chamber;
- an etching module comprising a first upper section, a first lower section, and a first middle section located between the first upper section and the first lower section, the etching module further comprising a first slot located in the first middle section, and the first slot being adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching;
- and
- a transfer module, disposed adjacent to the etching module and adapted to contain and clean the first etching chamber or the second etching chamber in a waferless state.
2 more elements
A semiconductor processing device, comprising:
- a first etching chamber;
- a second etching chamber;
- an etching module comprising a first slot, the first slot being adapted to interchangeably contain the first etching chamber or the second etching chamber for wafer etching;
- and
- a transfer module, disposed adjacent to the etching module and adapted to contain and clean the first etching chamber or the second etching chamber in a waferless state, the transfer module further comprising a transfer mechanism installed therein, wherein the first etching chamber and the second etching chamber in the transfer module are moved by the transfer mechanism.
2 more elements
Dependencies are inferred from the claim text.