Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate
AssigneeShibaura Mechatronics Corporation
InventorsKoichi HAMADA, Nobuo KOBAYASHI
Life of this patent
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Abstract
According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.
Claims11
A substrate treatment apparatus comprising:
- a substrate support unit supporting a substrate;
- a rotary unit rotating the substrate;
- a treatment liquid supply unit supplying treatment liquid to a surface of the substrate;
- and
- a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.
A substrate treatment method comprising:
- rotating a substrate;
- supplying treatment liquid to a surface of the substrate;
- heating the substrate with a heater disposed to face the substrate;
- changing liquid discharge velocity at which the treatment liquid is discharged from the surface of the substrate, by at least one of treatments of increasing rotation speed of the rotation, increasing supply quantity of the treatment liquid, and narrowing a gap between the substrate and the heater, at preset predetermined timing during substrate treatment, with the treatment continued.
A method for manufacturing a substrate, comprising:
- rotating a substrate;
- supplying treatment liquid to a surface of the substrate;
- heating the substrate with a heater disposed to face the substrate;
- changing liquid discharge velocity at which the treatment liquid is moved from the surface of the substrate, by at least one of treatments of increasing rotation speed of the rotation, increasing supply quantity of the treatment liquid, and narrowing a gap between the substrate and the heater, at preset predetermined timing during substrate treatment, with the treatment continued.
Dependencies are inferred from the claim text.