Electrical interconnect structure for an embedded electronics package
AssigneeGeneral Electric Company
InventorsPaul Alan McConnelee, Arun Virupaksha Gowda
Life of this patent
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Abstract
An electronics package includes a lower insulating layer, an upper insulating layer coupled to the lower insulating layer, and a conductive contact pad coupled to a second surface of the upper insulating layer. An electrical component is positioned within an opening formed through the upper insulating layer. A first interconnect layer extends through at least one via in the lower insulating layer to electrically couple with at least one contact pad on the electrical component and a second interconnect layer extends through at least one via in the upper insulating layer and electrically couples the first interconnect layer to the conductive contact pad.
Claims23
An electronics package comprising:
- a lower insulating layer;
- an upper insulating layer coupled to the lower insulating layer;
- a conductive contact pad coupled to a second surface of the upper insulating layer;
- an electrical component positioned within an opening formed through the upper insulating layer;
- a first interconnect layer extending through at least one via in the lower insulating layer to electrically couple with at least one contact pad on the electrical component;
- and
- a second interconnect layer extending through at least one via in the upper insulating layer and electrically coupling the first interconnect layer to the conductive contact pad.
An electronics package comprising:
- a first insulating layer having at least one component opening formed therein;
- a first electrical component positioned within the at least one component opening;
- a first metallization layer formed on a bottom surface of the first insulating layer and extending through at least one via formed therein;
- a second insulating layer coupled to the first insulating layer;
- at least one metalized contact layer formed on a top surface of the first insulating layer;
- and
- a second metallization layer formed on a bottom surface of the second insulating layer, the second metallization layer comprising a first portion electrically coupled to the first metallization layer and a second portion electrically coupled to at least one contact pad on the first electrical component;
- wherein a combined thickness of the first insulating layer and the at least one metalized contact layer is substantially equal to a thickness of the first electrical component.
An electronics package comprising:
- an upper insulating layer;
- at least one electrical component positioned within an opening in the upper insulating layer;
- a patterned contact layer comprising a plurality of electrical connections, wherein a first electrical connection of the plurality of electrical connections extends across a top surface of the upper insulating layer and a first surface of the at least one electrical component;
- a lower insulating layer having a top surface coupled to a bottom surface of the upper insulating layer and a second surface of the at least one electrical component;
- an upper interconnect layer formed on the bottom surface of the upper insulating layer and electrically coupled to the patterned contact layer;
- and
- a lower interconnect layer formed on a bottom surface of the lower insulating layer and electrically coupled to the upper interconnect layer and the at least one electrical component.
Dependencies are inferred from the claim text.