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US 2017/0250092 A1Published application
3DIC Package Comprising Perforated Foil Sheet
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorWensen Hung
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Abstract
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material. An upper layer of the thermal interface material is overlying the PFS, and a lower layer of thermal interface material is underlying the PFS. The thermal interface material fills through-openings in the PFS.
Claims20
A method comprising:
- dispensing a first thermal interface material over a device die;
- and
- placing a first portion of a Perforated Foil Sheet (PFS) overlying the first thermal interface material, wherein the PFS comprises a through-opening therein, and a portion of the first thermal interface material is exposed through the through-opening.
A method comprising:
- bonding a device die onto a top surface of a package substrate;
- dispensing a thermal interface material over the device die;
- placing a first portion of a Perforated Foil Sheet (PFS) sheet contacting the thermal interface material, wherein the thermal interface material comprises:
- a first portion overlapping the PFS sheet;
- a second portion underlying the PFS sheet;
- and
- a third portion in a through-opening in the PFS sheet;
- and
- fixing opposite end portions of the PFS sheet using adhesives.
6 more elements
A method comprising:
- bonding a device die onto a top surface of a package substrate;
- dispensing a first thermal interface material over the device die;
- placing a first portion of a Perforated Foil Sheet (PFS) sheet over and contacting the first thermal interface material, wherein a second portion of the PFS sheet extends beyond edges of the first thermal interface material;
- dispensing a second thermal interface material overlapping the first portion of the PFS sheet and the first thermal interface material;
- and
- placing a metal lid over the second thermal interface material.
3 more elements
Dependencies are inferred from the claim text.