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US 2017/0250090 A1Published application
Multi-Chip Structure and Method of Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Der-Chyang Yeh
Life of this patent
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Abstract
A device includes a redistribution layer over a molding compound layer, a first chip over the fan-out structure, wherein the first chip comprise a plurality of first through vias connected to the redistribution layer and a second chip over the first chip, the second chip being connected to the first chip through a plurality of bumps, wherein the first chip and the second chip are in the molding compound layer, and wherein a center line of the first chip is not vertically aligned with a center line of the second chip.
Claims20
A device comprising:
- a fan-out structure comprising a redistribution layer over a molding compound layer;
- a first chip over the fan-out structure, wherein the first chip comprise a plurality of first through vias connected to the redistribution layer;
- and
- a second chip over the first chip, the second chip being connected to the first chip through a plurality of bumps, wherein the first chip and the second chip are in the molding compound layer, and wherein a center line of the first chip is not vertically aligned with a center line of the second chip.
1 more element
A device comprising:
- a first chip and a second chip stacked together to form a multi-chip structure, wherein the first chip and the second chip are in an encapsulation layer, and wherein there is a separation between a center line of the first chip and a center line of the second chip;
- a redistribution layer on a surface of a first side of the encapsulation layer;
- and
- a plurality of conductive bumps over the redistribution layer.
1 more element
A method comprising:
- mounting a second chip on a first chip, and wherein a center line of the first chip is not vertically aligned with a center line of the second chip;
- forming a molding compound layer over the first chip and the second chip, wherein the first chip and the second chip are embedded in the molding compound layer;
- grinding the molding compound layer until a surface of the second chip is exposed;
- forming a redistribution layer on the surface of the second chip;
- and
- forming a plurality of bumps over the redistribution layer.
3 more elements
Dependencies are inferred from the claim text.