Direct Current Pulsing Plasma Systems
AssigneeLam Research Corporation
InventorsRoderick W. Boswell, Richard Alan Gottscho
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AssigneeLam Research Corporation
InventorsRoderick W. Boswell, Richard Alan Gottscho
Estimating the term…
A plasma processing system is provided that includes a chamber having a lower electrode coupled to a substrate support and an upper electrode coupled to ground. The plasma processing system having a plasma processing volume that is defined between the upper electrode and the lower electrode. A direct current (DC) to direct current (DC) converter is provided to receive at an input a DC voltage input and supply at an output an amplified DC voltage signal that includes a radio frequency (RF) component. The DC voltage input follows a pulsing pattern that is digitally programmable. The output of the DC to DC convertor is connected to the lower electrode of the chamber. A controller is interfaced with the DC to DC converter to set the pulsing pattern. In one example, the DC to DC converter uses one of a bipolar or non-bipolar DC voltage supply and a RF generator is driven by a DC voltage supply. The RF generator is configured to produce a frequency ripple that defines the RF component.
A plasma processing system, comprising,
A plasma processing system, comprising,
A method for processing a substrate using a capacitively coupled plasma (CCP) chamber driven by a DC to DC converter, comprising,
Dependencies are inferred from the claim text.