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US 2017/0250046 A1Published application
Chip fuse manufacturing method and chip fuse
AssigneeSOC Corporation
InventorsToshitaka OGAWA, Hiroo ARIKAWA
Life of this patent
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Abstract
A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.
Claims20
A method for manufacturing a chip fuse, comprising:
- a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate;
- a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light;
- and
- a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.
1 more element
A chip fuse comprising:
- a substrate;
- a fuse film provided on a principal surface of the substrate;
- and
- a first terminal group including a plurality of first terminals that are separated from each other in a longitudinal direction of the fuse film on the principal surface, the first terminal group being provided on each of both end sides of the longitudinal direction to connect to the fuse film.
1 more element
Dependencies are inferred from the claim text.