Multilayer ceramic electronic component and manufacturing method therefor
AssigneeMurata Manufacturing Co., Ltd.
InventorJyunichi NANJO
Life of this patent
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Abstract
A multilayer body includes laminated ceramic sheets. An IC and passive elements are mounted on a top surface of the multilayer body, and cavities are provided in side surfaces of the multilayer body. Bonding electrodes are provided in bottom surfaces of the cavities. A sealing resin is provided on the top surface of the multilayer body to seal the IC and the passive elements, and extends into the cavities to seal the bonding electrodes.
Claims19
A multilayer ceramic electronic component comprising:
- a multilayer body including a plurality of laminated ceramic sheets;
- and
- a sealing resin provided on a first surface of the multilayer body;
- wherein
- the multilayer body includes a cavity in a side surface thereof, a bonding electrode extending in a lamination direction is exposed at the cavity, and the sealing resin extends from the first surface of the multilayer body into the cavity and seals the bonding electrode.
A manufacturing method for a multilayer ceramic electronic component comprising:
- a preparation step of preparing a plurality of ceramic sheets, each of the plurality of ceramic sheets including a first through hole formed at a common position;
- a first filling step of filling the first through hole formed in each of the plurality of ceramic sheets with conductive paste to form a bonding electrode;
- a second through hole forming step of forming a second through hole in each of the plurality of ceramic sheets so as to remove a portion of the conductive paste with which the first through hole is filled in the first filling step;
- a laminating step of laminating the plurality of ceramic sheets so as to overlap the second through holes in a plan view, to produce a multilayer substrate;
- a resin applying step of applying a liquid sealing resin to a first surface of the multilayer substrate such that the sealing resin extends into the second through holes;
- and
- a dicing step of dicing the multilayer substrate at a position across the second through holes, after the resin applying step.
A manufacturing method for a multilayer ceramic electronic component comprising:
- a preparation step of preparing a plurality of ceramic sheets, each of the plurality of ceramic sheets including a first through hole formed at a common position;
- a first filling step of filling the first through hole formed in each of the plurality of ceramic sheets with conductive paste to form a bonding electrode;
- a laminating step of laminating the plurality of ceramic sheets so as to overlap the first through holes in a plan view, to produce a multilayer substrate;
- a second through hole forming step of forming a second through hole in the multilayer substrate so as to remove a portion of the conductive paste with which the first through hole is filled in the first filling step;
- a resin applying step of applying a liquid sealing resin to a first surface of the multilayer substrate such that the sealing resin extends into the second through hole;
- and
- a dicing step of dicing the multilayer substrate at a position across the second through hole, after the resin applying step.
Dependencies are inferred from the claim text.