US 2017/0249984 A1 · MULTI-MODE MEMORY DEVICE AND METHOD HAVING STACKED MEMORY DICE, A LOGIC DIE AND A COMMAND PROCESSING CIRCUIT AND OPERATING IN DIRECT AND INDIRECT MODES

Abstract

Memory device systems, systems and methods are disclosed, such as those involving a plurality of stacked memory device dice and a logic die connected to each other through a plurality of conductors. The logic die serves, for example, as a memory interface device to a memory access device, such as a processor. The logic die can include a command register that allows selective operation in either of two modes. In a direct mode, conventional command signals as well as row and column address signals are applied to the logic die, and the logic die can essentially couple these signals directly to the memory device dice. In an indirect mode, a packet containing a command and a composite address are applied to the logic die, and the logic die can decode the command and composite address to apply conventional command signals as well as row and column address signals to the memory device dice.

Claims20

Dependent claims

An apparatus comprising:

a logic die coupled to a plurality of stacked memory device dice through a plurality of conductors, the logic die being configured to write data to and read data from the plurality of stacked memory device dice responsive to one or more packets, the logic die including a command processing circuit, the command processing circuit configured to receive the one or more packets and configured to selectively operate in a first mode or a second mode, wherein in the first mode, the command processing circuit is configured to interpret a plurality of bits at a first location in a received packet as a row address strobe signal and a column address strobe signal, and wherein in the second mode, the command processing circuit is configured to interpret the plurality of hits at the first location in the received packet as at least a portion of a command code.

An apparatus comprising:

a plurality of stacked memory device dice;
and
a logic die coupled to the plurality of stacked memory device dice through respective buses, the logic die comprising:
a plurality of memory controllers, each memory controller of the plurality of memory controllers associated with a respective memory device die of the plurality of stacked memory device dice and comprising a command register configured to selectively operate to process a received packet in a first mode or a second mode, wherein in the first mode, the command register is configured to interpret a plurality of hits at a first location in the received packet as a row address strobe signal and a column address strobe signal, and wherein in the second mode, the command register is configured to interpret the plurality of bits at the first location in the received packet as at least a portion of a command code.

1 more element

Dependencies are inferred from the claim text.

Multi-mode memory device and method having stacked memory dice, a logic die and a command processing circuit and operating in direct and indirect modes

Life of this patent

Multi-mode memory device and method having stacked memory dice, a logic die and a command processing circuit and operating in direct and indirect modes

Life of this patent

Abstract

Claims20