Chip Card Manufacturing Method, and Chip Card Obtained by Said Method
AssigneeLinxens Holding
InventorsEric EYMARD, Cyril PROYE, Nicolas GUERINEAU
Life of this patent
Estimating the term…
Loading patent…
AssigneeLinxens Holding
InventorsEric EYMARD, Cyril PROYE, Nicolas GUERINEAU
Estimating the term…
A chip card manufacturing method. A module includes a substrate supporting contacts on one surface and conductive paths and a chip on another; and an antenna on a holder, the antenna including a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the solder drops remain accessible. The height of the solder drops before heating is suitable for projecting into the cavity. A module is placed in each cavity. The areas of the module that are located on the solder drops are heated to melt the solder and to solder the contact pads of the antenna to conductive paths of the module.
A method for manufacturing a chip card, comprising:
An antenna inlay for a chip card, with an antenna enabling electromagnetic coupling to a contactless card-reading device, the antenna having two ends and a connection pad respectively at each of its ends, characterized in that it furthermore has a solder material on each of its connection pads of the antenna, the thickness of the solder material being between 0.02 and 0.5 mm.
A chip card comprising
Dependencies are inferred from the claim text.