Fingerprint Sensor Device and Method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
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Abstract
A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
Claims21
A method of manufacturing a semiconductor device, the method comprising:
- attaching a sensor surface material over a sensor chip, wherein the sensor chip comprises:
- a semiconductor substrate;
- and
- an array of electrodes between the semiconductor substrate and the sensor surface material;
- attaching a high voltage chip in electrical connection with the sensor chip, wherein the high voltage chip is located on an opposite side of the sensor chip than the sensor surface material;
- and
- attaching the sensor chip to a substrate, wherein the high voltage chip is located within an opening of the substrate after the attaching the sensor chip to the substrate.
A method of manufacturing a semiconductor device, the method comprising:
- forming through vias through a sensor substrate;
- forming an array of electrodes over the sensor substrate, wherein the array of electrodes are in electrical connection with active devices on a first side of the sensor substrate;
- attaching a sensor cover over the first side of the sensor substrate;
- attaching a high voltage chip in electrical connection with the active devices, wherein the high voltage chip is located on an opposite side of the sensor substrate from the array of electrodes;
- and
- placing the high voltage chip into an opening located within a second substrate.
-20. (canceled)
A method of manufacturing a semiconductor device, the method comprising:
- manufacturing through vias to electrically connect a first side of a sensor chip with a conductive element located on a second side of the sensor chip opposite the first side;
- placing a high voltage chip in electrical connection with the through vias;
- and
- placing a substrate in electrical connection with the through vias, wherein after the placing the high voltage chip and after the placing the substrate the high voltage chip is located within an opening of the substrate.
Dependencies are inferred from the claim text.