Testing holders for chip unit and die package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMill-Jer WANG, Kuo-Chuan LIU, Ching-Nen PENG, Hung-Chih LIN, Hao CHEN
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Abstract
A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
Claims20
A testing holder for a chip unit, comprising:
- a holder body configured to contain the chip unit;
- and
- a pressure releasing device formed on the holder body configured to release an insertion pressure when the chip unit is inserted in the holder body.
A multi site holding frame for a plurality of chip units, comprising:
- a first holder frame having a plurality of testing holders, each of the plurality of testing holders including a holder body configured to contain one of the plural chip units,
- wherein the holder frame comprises:
- a power supply, and a temperature controller;
- and
- a multi site probe card,
- wherein the multi site probe card includes plural contact probes and plural contactless coils.
A method of testing a plurality of chip units, comprising:
- inserting a first chip unit into a testing holder and inserting a second chip unit into a second testing holder,
- wherein the first chip unit and the second chip unit have different dimensions, and the first testing holder and second testing holder have same outer dimensions;
- inserting the first testing holder and the second testing holder into a first open recess and a second open recess, respectively, of a holder frame;
- positioning a multi-site probe card having a plurality of probe contacts and a plurality of contactless coils over the holder frame;
- and
- testing the first chip unit and the second chip unit to determine whether the first and second chip units are defective chip units.
Dependencies are inferred from the claim text.