Enhanced plating bath and additive chemistries for cobalt plating
AssigneeApplied Materials, Inc.
InventorsIsmail EMESH, Roey SHAVIV, Chris PABELICO
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Abstract
Implementations of the disclosure may include methods of electroplating features formed on a semiconductor device, such as the trenches and vias formed by single or dual Damascene processes using a cobalt plating bath. The cobalt electroplating bath may contain “additive packages” or “additive systems” that include a combination of additives in certain ratios that facilitate the metal filling of high aspect ratio sub-micrometer features. Implementations of the disclosure provide new cobalt plating bath methods and chemistries and that include alkyl modified imidazoles, imidazolines, and imidazolidines suppressor compounds.
Claims20
A method of forming a cobalt layer on a substrate, comprising:
- immersing a substrate having a conductive layer disposed thereon in a cobalt plating bath, wherein the cobalt plating bath comprises:
- a first amount of a cobalt ion;
- and
- a first amount of at least one suppressor compound comprising an imidazole, imidazoline, or imidazolidine group, and wherein the imidazole, imidazoline, or imidazolidine group comprises an alkyl group;
- and
- biasing the conductive layer relative to an anode that is in electrical communication with the cobalt plating bath and the conductive layer to form a cobalt layer on the surface of the conductive layer.
A method of forming a cobalt electroplating bath, comprising:
- dispensing a first amount of a cobalt ion source into a first vessel;
- dispensing a first amount of at least one suppressor compound into the first vessel, wherein the at least one suppressor compound comprises an imidazole, imidazoline, or imidazolidine group, and the imidazole, imidazoline, or imidazolidine group comprises an alkyl ether group;
- and
- adjusting the cobalt electroplating bath to a pH between about 4 and about 9.
An additive system for electroplating a cobalt layer on a substrate, comprising:
- at least one suppressor compound comprising an imidazole, imidazoline, or imidazolidine group, wherein the imidazole, imidazoline, or imidazolidine group comprises an alkyl group.
Dependencies are inferred from the claim text.