Curable composition and resin for treatment of a subterranean formation
AssigneeHalliburton Energy Services, Inc.
InventorGreg Robert Hundt
Life of this patent
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Abstract
Various embodiments disclosed relate to a curable composition and resin for treatment of a subterranean formation. In various embodiments, the present invention provides a method of treating a subterranean formation. The method can include placing in a subterranean formation a curable composition. The curable composition can include an epoxy silane monomer, a hardener, and carrier fluid. The curable composition can include an epoxy monomer, an amine silane hardener, and carrier fluid. The method can also include curing the curable composition to form an epoxy silane resin.
Claims21
-81. (canceled)
A method of treating a subterranean formation, comprising:
- placing a curable composition into the subterranean formation, the curable composition comprising:
- an epoxy silane monomer;
- a hardener;
- and
- a carrier fluid;
- and
- curing the curable composition to form an epoxy silane resin.
A method of treating a subterranean formation, comprising:
- placing a curable composition into the subterranean formation, the curable composition comprising:
- an epoxy silane monomer having a structure chosen from:
- wherein the epoxy silane monomer comprises about 40 wt %
- to about 80 wt % of the curable composition;
- a hardener having a structure chosen from:
- wherein n is 1 to 5,
- wherein the hardener comprises about 5 wt % to about 50 wt % of the curable composition;
- and
- a carrier fluid comprising water, wherein the carrier fluid comprises about 1 wt % to about 40 wt % of the curable composition;
- and
- curing the curable composition to form an epoxy silane resin.
A curable composition for treatment of a subterranean formation, comprising:
- an epoxy silane monomer selected from:
- wherein the epoxy silane monomer comprises about 55 wt % to about 70 wt % of the curable composition;
- a hardener selected from:
- wherein n is 1 to 4,
- wherein the hardener comprises about 15 wt % to about 35 wt % of the curable composition;
- and
- a carrier fluid comprising water, wherein the carrier fluid comprises about 5 wt % to about 25 wt % of the curable composition.
Dependencies are inferred from the claim text.