MEMS Integrated Pressure Sensor and Microphone Devices and Methods of Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hua Chu, Chun-Wen Cheng
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hua Chu, Chun-Wen Cheng
Estimating the term…
A micro-electromechanical systems (MEMS) device includes a MEMS substrate having a first opening, a second opening, and a membrane layer comprising a first membrane disposed over the first opening and a second membrane disposed over the second opening. The MEMS device also includes a carrier substrate bonded to a first side of the MEMS substrate, the carrier substrate having a first cavity exposing the first membrane and a second cavity exposing the second membrane, and a cap substrate bonded to a second side of the MEMS substrate. The cap substrate has a third cavity connected to the first opening and a fourth cavity connected to the second opening. The first membrane, the first cavity, and the third cavity are part of a pressure sensor. The fourth cavity extends completely through the cap substrate. The second membrane, the second cavity, and the fourth cavity are part of a microphone.
A micro-electromechanical systems (MEMS) device comprising:
A micro-electromechanical systems (MEMS) device comprising:
A micro-electromechanical systems (MEMS) device comprising:
Dependencies are inferred from the claim text.