Micro-electro-mechanical pressure device and methods of forming same

A process for manufacturing a micro-electro-mechanical pressure sensor device, the process comprising:

• forming a buried cavity in a first body of a semiconductor material, the buried cavity delimiting a membrane at a first face of the first body;
• forming, within the first body, a trench, the trench delimiting a sensitive portion including the buried cavity, a supporting portion, and a spring portion, wherein the spring portion couples the sensitive portion to the supporting portion, the spring portion including a channel that fluidically couples the buried cavity to a first portion of the first face of the first body;
• and
• bonding a second body to the first face of the first body to form a first air gap over the membrane, wherein bonding the second body to the first face of the first body comprises forming a sealing structure that fluidically isolates the first portion of the first face of the first body from a second portion of the first face of the first body.

An electronic device comprising:

• a controller;
• and
• a pressure sensor coupled to the controller, the pressure sensor including:
• a body of semiconductor material having a first face, a buried cavity, the buried cavity forming a membrane suspended by the buried cavity;
• a through trench in the body, the through trench delimiting a sensitive portion housing the membrane and a spring portion, the spring portion coupling the sensitive portion to a supporting portion;
• and
• a channel in the spring portion, the channel fluidically coupling the buried cavity to a first portion of the first face of the body, the first portion of the first face being fluidically isolated from a second portion of the first face of the body, the second portion being in fluid communication with an external environment.