Semiconductor package and method of manufacturing the same
AssigneesSamsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
InventorsMin-woo SONG, Sung-il CHO, Se-gi BYUN, Jin YU
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Abstract
A method of manufacturing a semiconductor package including coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), placing a solder ball on the connection pad coated with the flux, forming a solder layer attached to the connection pad from the solder ball through a reflow process, and mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip may be provided.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs);
- placing a solder ball on the connection pad coated with the flux;
- forming a solder attached to the connection pad from the solder ball through a reflow process;
- and
- mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad in the semiconductor chip.
A method of manufacturing a semiconductor package, the method comprising:
- coating a flux on a connection pad provided on a first surface of a substrate, the flux including carbon nanotubes (CNTs), a hydrophilic functional group being attached to the CNTs;
- placing a solder ball on the connection pad coated with the flux;
- forming a solder attached to the connection pad from the solder ball through a reflow process;
- and
- mounting a semiconductor chip on the substrate such that the solder layer faces a connection pad provided in the semiconductor chip.
A method of manufacturing a semiconductor package, the method comprising:
- providing a connection pad on a surface of a substrate;
- coating a flux on the connection pad, the flux including a flux agent having carbon nanotubes (CNTs) and a hydrophilic functional group attached to the CNTs;
- placing a solder ball on the connection pad coated with the flux;
- performing a reflow process to the solder ball such that the solder ball contacts the connection pad through the flux and the flux at least partially covers lower sides of sidewalls of the solder ball and the substrate;
- mounting a semiconductor chip on the substrate such that a reflowed structure of the solder ball faces a connection pad in the semiconductor chip.
Dependencies are inferred from the claim text.