Method for electrodeposition on a conductive particulate substrate
AssigneeBAE SYSTEMS plc
InventorsAmy Elizabeth Dyke, Michael Dunleavy
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Abstract
The present invention relates to a method of electrodepositing a metal on an electrically conductive particulate substrate. There is provided a method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of: (i) providing a cathode; (ii) providing an anode formed from the metal to be electrodeposited; (iii) providing the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte; and (iv) providing a voltage between said anode and cathode causing metal ions to flow from the anode to the cathode, wherein a separator is provided between the anode and the cathode.
Claims15
A method of electrodepositing a metal on an electrically conductive particulate substrate comprising the steps of:
- providing a cathode;
- providing an anode formed from the metal to be electrodeposited;
- locating the substrate, cathode and anode within an electrodeposition bath comprising an electrolyte;
- and
- applying a voltage between said anode and cathode, thereby causing metal ions to flow from the anode to the cathode.
A conductive particulate substrate material with an average largest dimension of less than 10 mm comprising at least one layer of an electrodeposited metal thereon.
Dependencies are inferred from the claim text.