Substrate supports with multi-layer structure including independent operated heater zones

A substrate support configured to support a substrate in a plasma processing chamber, the substrate support comprising:

• a first insulative layer comprising a plurality of heater zones and a plurality of power supply lines, wherein the plurality of heater zones are arranged in rows and columns, and wherein the plurality of power supply lines are connected to the plurality of heater zones;
• a second insulative layer comprising a first plurality of conductive vias and a second plurality of conductive vias,
• wherein
• first ends of the first plurality of conductive vias are connected to the plurality of power supply lines,
• first ends of the second plurality of conductive vias are connected to the plurality of heater zones,
• second ends of the first plurality of conductive vias are connected to a first plurality of leads, and
• second ends of the second plurality of conductive vias are connected to a plurality of power return lines, wherein the plurality of return lines are connected to a second plurality of leads;
• and
• a cooling plate comprising a first conduit and a second conduit,
• wherein
• the first plurality of leads extend through the first conduit,
• the second plurality of leads extend through the second conduit, and
• the plurality of heater zones are configured to heat corresponding portions of the substrate to provide a predetermined temperature profile across the substrate during processing of the substrate in the plasma processing chamber.