Refractory metal inks and related systems for and methods of making high-melting-point articles
AssigneeQI2 Elements, LLC
InventorsVincent Fratello, Giovanni Nino, Arjun Wadhwa
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AssigneeQI2 Elements, LLC
InventorsVincent Fratello, Giovanni Nino, Arjun Wadhwa
Estimating the term…
Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.
A refractory metal ink comprising a refractory metal species and a solvent, wherein the refractory metal ink is configured to form an alloy that is hardened against grain boundary motion when the solvent is removed.
An article at least partially deposited from a refractory metal ink, wherein the article comprises one of the group consisting of a metal alloy and an inclusion of a solid non-metal particle and wherein the article is hardened against high-temperature grain boundary motion.
Dependencies are inferred from the claim text.