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AssigneeTokyo Electron Limited
InventorsAkihiro KUBO, Masahiro FUKUDA, Taro YAMAMOTO, Kenzi YADA, Masashi ENOMOTO, Noboru NAKASHIMA
Estimating the term…
There is disclosed a polishing cleaning mechanism configured to be in contact with a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, including a cleaning member configured to clean the rear surface of the substrate, a polishing member configured to polish the rear surface of the substrate, and a support member configured to support the polishing member and the cleaning member to face the rear surface of the substrate held in the substrate holding unit, wherein a surface of the polishing member facing the substrate and a surface of the cleaning member facing the substrate differ in relative height from each other.
1-19. (canceled)
A polishing cleaning mechanism configured to be in contact with a part of a rear surface of a substrate which is held in a substrate holding unit for holding the rear surface of the substrate and perform a polishing process and a cleaning process on the rear surface of the substrate, comprising:
A substrate processing apparatus provided with the polishing cleaning mechanism of claim 2 and configured to perform the polishing process and the cleaning process on the rear surface of the substrate held in the substrate holding unit for holding the rear surface of the substrate, comprising:
Dependencies are inferred from the claim text.