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AssigneeQUALCOMM Incorporated
InventorsYoung Kyu Song, John Jong Hoon Lee, Sangjo Choi
Estimating the term…
Some features pertain to a package substrate that includes at least one dielectric layer, an inductor in the at least one dielectric layer, a first terminal coupled to the inductor, a second terminal coupled to the inductor, and a third terminal coupled to the inductor. The first terminal is configured to be a first port for the inductor. The second terminal is configured to be a second port for the inductor. The third terminal is a dummy terminal. In some implementations, the package substrate includes a solder resist layer over the dielectric layer, where the solder resist layer covers the third terminal. In some implementations, the package substrate includes a solder interconnect over the third terminal, such that the solder resist layer is between the third terminal and the solder interconnect. In some implementations, the package substrate is coupled to a die comprising a plurality of switches.
A package substrate comprising:
An apparatus comprising:
A method for tuning an inductor, comprising:
A processor-readable storage medium comprising code for:
Dependencies are inferred from the claim text.