Robot teaching position correcting method and system
AssigneeBeijing Naura Microelectronics Equipment Co., Ltd.
InventorDong Xu
Life of this patent
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Abstract
A robot teaching position correcting method and system is provided. The robot is driven to move along wafer pick-and-place operation paths defined by a sequence of waypoints. Distances between the waypoint and a wafer supporter of the wafer carrier above the waypoint are detected by upper sensors provided on a top surface of the robot when the robot is positioned at the waypoint. Then, the position parameter of the waypoint is corrected accordingly, so as to ensure safe wafer handling.
Claims19
A robot teaching position correcting method, wherein the robot comprises a fork mounted on a fixed base station for picking up and placing target wafers on supporters of a wafer carrier, the correcting method comprises:
- Step S1:
- offline obtaining robot teaching data including position parameters of a sequence of waypoints which define pick-up operation paths or place operation paths of the target wafers;
- Step S2:
- providing at least three non-linear arranged upper sensors on a top surface of the fork or a top surface of a dummy wafer fixed on the fork;
- Step S3:
- driving the robot to move along the pick-up operation path or the place operation path of each target wafer, and at each waypoint driving the upper sensors to detect distances between the waypoint and an adjacent supporter above the waypoint;
- Step S4:
- at each waypoint, correcting a position parameter of the waypoint according to the distances detected by the upper sensors.
A robot teaching position correcting system, wherein the robot comprises a fork mounted on a fixed base station for picking up and placing target wafers on supporters in a wafer carrier, the correcting system comprises:
- at least three non-linear arranged upper sensors provided on a top surface of the fork or a top surface of a dummy wafer fixed on the fork;
- a store module storing robot teaching data including position parameters of a sequence of waypoints which define pick-up operation paths or place operation paths of the target wafers;
- a drive module driving the robot to move along the pick-up operation path or the place operation path of each target wafer and at each waypoint driving the upper sensors to detect distances between the waypoint and an adjacent supporter above the waypoint;
- a correct module correcting the position parameters of the waypoints according to the distances detected by the upper sensors.
Dependencies are inferred from the claim text.