Transparent material processing with an ultrashort pulse laser
AssigneeImra America, Inc.
InventorsJames BOVATSEK, Alan Y. ARAI, Fumiyo YOSHINO
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Abstract
A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.
Claims6
A method of scribing a transparent material, comprising:
- using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a surface groove in said material and at least one modified region within the bulk of said material.
A method for scribing a transparent material comprising using a single scan of a focused beam of ultrashort laser pulses to simultaneously create a plurality of modification regions within the bulk of said material in its depth direction.
A transparent material scribed at two or more locations in a depth direction thereof by a single scan of a focused beam of ultrashort laser pulses.
A system for scribing a transparent material, comprising:
- an ultrashort laser source to generate a beam of ultrashort pulses;
- an optical system to focus and deliver said beam of ultrashort pulses to said material with optical intensity sufficiently high so as to produce non-linear absorption within said material and to modify said material so as to produce scribe features;
- and a motion system operatively connected to said ultrashort source and said optical system.
Dependencies are inferred from the claim text.