Card substrate warpage reduction

A transfer lamination process using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon, the transfer ribbon includes a carrier layer and a transfer layer attached to the carrier layer, the transfer layer is divided into a plurality of transfer panels, and each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels, the transfer lamination process comprising:

• transferring a transfer section of the transfer layer of one of the transfer panels from the carrier layer to a first surface of a substrate using the transfer unit including:
• heating the transfer section and pressing the transfer section against the first surface of the substrate using the transfer unit;
• and
• detaching the carrier layer from the transfer section;
• inverting the substrate using the substrate rotator;
• and
• heating the second surface of the substrate that is opposite the first surface through the carrier layer and one of the gaps in the transfer layer using the transfer unit.

A transfer ribbon for use in a transfer lamination process comprising:

• a carrier layer;
• and
• a plurality of transfer panels each comprising a transfer layer attached to the carrier layer;
• wherein each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels along a longitudinal axis of the carrier layer.