Clamping device for soldering operations
AssigneesHongfujin Precision Electronics (Zhengzhou) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
InventorsXI-HANG LI, BING LIU, WEI WU, QING-LEI PAN, SHI-LI ZHANG, YUAN GAO
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Abstract
A clamping device which uses its own weight to apply pressure during a soldering operation to a solderable part or component for attachment to a circuit board is provided. The clamping device includes a base plate and at least one press block which is configured to be arranged on the base plate and is free to move up or down by gravity relative to the base plate. When the gravitational orientation of the clamping device is correct, the press block moves down relative to the base plate and so presses on the solderable part during soldering.
Claims12
A clamping device for soldering operations, the clamping device comprising:
- a base plate;
- and
- at least one press block configured to be arranged on the base plate, wherein the at least one press block is configured to be moved up or down relative to the base plate;
- wherein when the at least one press block moves down relative to the base plate, the weight of the at least one press block exerts pressure on the base plate.
Dependencies are inferred from the claim text.