Vacuum integrated electronic device and manufacturing process thereof
AssigneesSTMicroelectronics S.r.l., Stmicroelectronics Pte Ltd
InventorsDavide Giuseppe Patti, Myung Sung Kim
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Abstract
A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
Claims20
A vacuum integrated electronic device comprising:
- an anode region of conductive material;
- an insulating region on top of the anode region;
- a cavity extending through the insulating region and having a sidewall;
- and
- a cathode region having a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity.
A process for manufacturing a vacuum integrated electronic device, comprising:
- forming an insulating region on top of an anode region of conductive material;
- forming a cavity through the insulating region, the cavity having a sidewall;
- and
- forming a cathode region having a tip portion extending peripherally within the cavity, adjacent to the sidewall.
A vacuum integrated electronic device comprising:
- an anode region of conductive material;
- a cathode region;
- an insulating region positioned between the anode and cathode regions;
- and;
- a cavity extending through the insulating region and having a sidewall, wherein the cathode region has a tip portion extending into the cavity and to the sidewall of the cavity.
Dependencies are inferred from the claim text.