# US 2017/0133259 A1 · System and Method for Peeling a Semiconductor Chip From a Tape Using a Multistage Ejector > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2017/0133259 A1 - Document ID: US20170133259A1 - Status: Published application - Kind: A1 - Application number: 15/319,259 - Filed: 2015-05-13 - Published: 2017-05-11 - Earliest claimed: 2014-06-18 - Assignees: Manufacturing Integration Technology Ltd - Applicants: Manufacturing Integration Technology Ltd - Inventors: Kim Mone KWONG; Kok Yeow LIM; Zhiqiang MAO - Web page: https://patentgrep.com/patent/US20170133259A1 ## CPC - H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes} - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - H10P 72/78: using vacuum or suction, e.g. Bernoulli chucks - H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support} - H10P 72/7416: {used during dicing or grinding} - H10P 72/742: {involving stretching of the auxiliary support post dicing} - H10P 72/7428: {used to support diced chips prior to mounting} - H10P 72/7442: {Separation by peeling} - Y10S 156/932: with poking during delaminating, e.g. jabbing release sheet backing to remove wafer - Y10S 156/943: with poking delaminating means, e.g. jabbing means - Y10T 156/1132: Using vacuum directly against work during delaminating - Y10T 156/1179: with poking during delaminating [e.g., jabbing, etc.] - Y10T 156/1944: Vacuum delaminating means [e.g., vacuum chamber, etc.] - Y10T 156/1983: Poking delaminating means - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A system and method for peeling a semiconductor chip from a tape using a multistage ejector is disclosed. A housing in the multistage ejector houses a plural sets of tape removing contacts. A pick and place unit is moved slowly to have contact with the chip. A vacuum source is utilized for generating vacuum to suck the tape. Plural sets of contacts such as inner, middle and outer contacts are independently or together moved below the tape at various stages by utilizing their respective actuation mechanism. A controller can independently control the movements of each contact to effectively remove or loosen the tape from the chip. A pick and place unit can then pick up the chip easily without any damage to chip. ## Claims ### Claim 1 A system for peeling a semiconductor chip from a tape, the system comprising: a housing having a top surface, wherein the top surface is positioned under the tape on which the chip is attached; a plural sets of tape removing contacts provided at the center of the top surface of the housing, wherein each of the plural sets of tape removing contacts is capable of moving independently or together with the other sets; a plurality of vacuum channels surrounding the plural sets of tape removing contacts; a vacuum source coupled to the plurality of vacuum channels for creating a vacuum to hold the tape firmly; and a controller for controlling the vacuum source and the plural sets of tape removing contacts, wherein the chip is removed from the tape due to the synchronous movement of the plural sets of tape removing contacts once the vacuum source is turned on. ### Claim 2 (depends on 1) The system of claim 1, wherein the plural sets of tape removing contacts comprises: an inner set of contacts located at the centre of the top surface of the housing; a middle set of contacts surrounding the inner set of contacts; and an outer set of contacts surrounding the middle set of contacts, wherein the controller triggers individual or collective movement of the inner set of contacts, middle set of contacts and outer set of contacts. ### Claim 3 (depends on 1) The system of claim 1, wherein each set of the plural sets of tape removing contacts is coupled to a respective actuation mechanism that facilitates its movement based upon trigger received from the controller. ### Claim 4 (depends on 1) The system of claim 1, wherein contacts of the plural sets of tape removing contacts comprises at least one of pins or needles. ### Claim 5 (depends on 1) The system of claim 1, further comprising a pickup and place unit operatively coupled to the free surface of the chip, wherein the pickup and place unit removes the chip from the tape once the chip is loosened from the tape. ### Claim 6 (depends on 1) The system of claim 1, wherein the housing comprises a pepper pot. ### Claim 7 (depends on 1) The system of claim 1, wherein the plurality of vacuum channels are concentric in shape. ### Claim 8 A method for peeling a semiconductor chip from a tape, the method comprising: placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position; coupling a pickup and place unit to the free surface of the chip; creating a vacuum for holding the tape firmly to the top surface of a housing; moving the plural sets of tape removing contacts upwards by a first predefined distance; simultaneously, moving the pickup and place unit upwards by the first predefined distance; selectively moving at least one set of the plural sets of tape removing contacts downwards to effectively loosen the tape from the chip in steps till all the sets of the plural sets of tape removing contacts are moved downwards; and removing the chip using the pickup and place unit after all the sets of the plural sets of tape removing contacts are moved downwards. ### Claim 9 (depends on 8) The method of claim 8, wherein the selectively moving one set of the plural sets of tape removing contacts comprising: moving an outer set of contacts of the plural sets of tape removing contacts downwards; moving subsequently a middle set of contacts of the plural sets of tape removing contacts downwards; and moving thereafter an inner set of contacts of the plural sets of tape removing contacts downwards, leaving the chip coupled to the pickup and place unit. ### Claim 10 (depends on 8) The method of claim 8, wherein the selectively moving one set of the plural sets of tape removing contacts comprising selectively moving under the control of a controller. ### Claim 11 (depends on 8) The method of claim 8, further comprising turning off the vacuum after the chip is removed. ### Claim 12 A method for peeling a semiconductor chip from a tape, the method comprising: placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position; coupling a pickup and place unit to the free surface of the chip; creating a vacuum for holding the tape firmly to the top surface of a housing; moving the plural sets of tape removing contacts upwards by a first predefined distance; moving, simultaneously, the pickup and place unit upwards by the first predefined step; moving at least one set of the plural sets of tape removing contacts further upwards in steps of second and third predefined distance; and removing the chip using the pickup and place unit when only the last set of the plural sets of tape removing contacts is attached to the tape. ### Claim 13 (depends on 12) The method of claim 12, wherein the moving the plural sets of tape removing contacts upwards in steps comprising: moving upwards the middle and inner sets of contacts of the plural sets of tape removing contacts by the second predefined distance followed by moving upwards the inner set of contacts of the plural sets of tape removing contacts by the third predefined distance. ### Claim 14 (depends on 12) The method of claim 12 further comprising reducing the number of plural sets of tape removing contacts by one compared to the previous step at the time of moving at least one set of the plural sets of tape removing contacts upwards in steps of second and third predefined distance. ### Claim 15 (depends on 12) The method of claim 12, wherein the moving the plural sets of tape removing contacts comprising moving under the control of a controller. ### Claim 16 (depends on 12) The method of claim 12, further comprising turning off the vacuum after the chip is removed. ### Claim 17 A method for peeling a semiconductor chip from a tape, the method comprising: placing plural sets of tape removing contacts under the tape on which the chip is attached, wherein the plural sets of tape removing contacts are in a non-activated position; coupling a pickup and place unit to the free surface of the chip; creating a vacuum for holding the tape firmly to the top surface of a housing; moving alternate sets of the plural sets of tape removing contacts upwards by a first predefined distance; simultaneously, moving the pickup and place unit upwards by the first predefined distance; selectively moving at least one set of alternate sets of the plural sets of tape removing contacts downwards by the first predefined distance and other set of alternate sets of the plural sets of tape removing contacts upwards by a second predefined distance; moving the middle set of tape removing contacts and the other set of the alternate sets of the plural sets of tape removing contacts upwards by a third predefined distance to effectively loosen the tape from the chip in steps till all the upward moved plural sets of tape removing contacts are moved downwards; and removing the chip using the pickup and place unit after all the sets of the plural sets of tape removing contacts are moved downwards.