Electronic component mounting method and electronic component mounting system

An electronic component mounting method comprising:

• setting a portion of multiple electronic component mounters as independent production mounters and the remaining portion of the multiple electronic component mounters as second lane dedicated mounters;
• allocating mounting of a first set of electronic components on a first board to a first mounting head of the independent production mounters;
• and
• allocating mounting of a second set of electronic components on a second board to a second mounting head of the independent production mounters and to a first mounting head and a second mounting head of the second lane dedicated mounters,
• the electronic component mounting method being a method in which at least one of the component quantity or the component types are different for the first set of electronic components to be mounted on the first board and the second set of electronic components to be mounted on the second board, and using an electronic component mounting system in which multiple component mounters are arranged in series with respective first conveyance lanes of the component mounters connected in series and respective second conveyance lanes of the component mounters connected in series, the component mounters being equipped with
• a board conveyance device having a first conveyance lane that loads and unloads a first board and a second conveyance lane that loads and unloads a second board, and
• a board transfer device having
• a first mounting head, provided adjacent to the first conveyance lane, that is capable of movement and of mounting electronic components on the first board loaded on the first conveyance lane and of mounting electronic components on the second board loaded on the second conveyance lane, and
• a second mounting head, provided adjacent to the second conveyance lane, that is capable of movement and of mounting electronic components on the first board loaded on the first conveyance lane and of mounting electronic components on the second board loaded on the second conveyance lane.