Method for producing a hermetic housing for an electronic device
Assigneemb-microtec ag
InventorsHeinz BLUNIER, Hannes KIND, Sandro M.O.L. SCHNEIDER
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Abstract
A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
Claims57
Method for the production of a housing having at least one hermetically sealed accommodation space for an electronic device, comprising at least a part of an interior of the housing, comprising the steps:
- producing/making available a hollow body made of glass, having at least one opening,
- introducing, positioning and/or fixing in place at least one electronic device through the at least one opening,
- closing off and welding the at least one opening by means of laser radiation, wherein a tubular base body is severed by means of melting it, for production of the housing, wherein the melted material closes off the resulting ends, and wherein the inside and outside of the housing have a differently great pressure force exerted on them in the region of the severing location, during the severing process and/or closing process of the tubular housing.
Dependencies are inferred from the claim text.