Mold and manufacturing method thereof
AssigneeKTX Co., Ltd.
InventorKatsuya SATO
Life of this patent
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Abstract
A mold includes a mold body, a porous conductive sheet and an electroformed metal. The porous conductive sheet is placed on a back surface of the mold body, has a plurality of through holes, and is conductive at least at its surface. The electroformed metal is electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet. In the mold, an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.
Claims20
A mold comprising:
- a mold body;
- a porous conductive sheet placed on a back surface of the mold body, having a plurality of through holes, and being conductive at least at its surface;
- and
- an electroformed metal electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet, wherein
- an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.
A method for manufacturing a mold, comprising the steps of:
- placing a porous conductive sheet having a plurality of through holes and being conductive at least at its surface on a back surface of a mold body;
- and
- performing electroforming to cause an electroformed metal to be electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet so that an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.
Dependencies are inferred from the claim text.