Lithography Alignment Marks
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChing-Huang Chen, Hung-Chang Hsieh, Kuei-Liang Lu, Ya Hui Chang
Life of this patent
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Abstract
A device for semiconductor fabrication includes a substrate and a layer formed over the substrate, wherein the layer includes an alignment mark. The alignment mark includes a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction. The alignment mark further includes a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions.
Claims20
A device for semiconductor fabrication, comprising:
- a substrate;
- and
- a layer formed over the substrate, the layer having an alignment mark,
- wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction;
- and
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions.
A device for semiconductor fabrication, comprising:
- a substrate;
- and
- a layer formed over the substrate, the layer having an alignment mark,
- wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction;
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions;
- a third plurality of elongated members that are oriented lengthwise along the first direction and are distributed along a fourth direction that is different from each of the first, second, and third directions;
- and
- a fourth plurality of elongated members that are oriented lengthwise along the third direction and are distributed along the fourth direction.
A device for semiconductor fabrication, comprising:
- a semiconductor substrate;
- and
- a layer formed over the semiconductor substrate, the layer having an alignment mark,
- wherein the alignment mark includes:
- a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction;
- and
- a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions,
- wherein:
- the first and second pluralities of elongated members each include copper;
- spaces between each of the first and second pluralities of elongated members are filled with an extreme low-k dielectric material;
- each of the first plurality has a first width;
- each of the second plurality has a second width;
- and
- the first width is greater than the second width.
Dependencies are inferred from the claim text.