Petri Net-based Scheduling of Time Constrained Single-arm Cluster Tools with Wafer Revisiting
AssigneeMacau University of Science and Technology
InventorsNaiqi Wu, Zicheng Liu
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AssigneeMacau University of Science and Technology
InventorsNaiqi Wu, Zicheng Liu
Estimating the term…
It is very difficult to schedule a single-arm cluster tool with wafer revisiting such that wafer residency time constraints are satisfied. The present invention conducts a study on this challenging problem for a single-arm cluster tool with atomic layer deposition (ALD) process. With a so called p-backward strategy being applied, a Petri net model is developed to describe the dynamic behavior of the system. Based on the model, existence of a feasible schedule is analyzed, schedulability conditions are derived, and scheduling algorithms are presented if there is a schedule. A schedule is obtained by simply setting the robot waiting time if schedulable and it is very computationally efficient. The obtained schedule is shown to be optimal. Illustrative examples are given to demonstrate the proposed approach.
A computer-implemented method for scheduling a cluster tool, the cluster tool comprising a single-arm robot for wafer handling, a wafer-processing system comprising four process modules including PM1, PM2, PM3, and PM4, each for performing a wafer-processing step with a wafer residency time constraint where the ith process module, iε{1, 2, . . . , 4}, is used for performing Step i of the wafer-processing steps for each wafer, and a wafer flow pattern having (PM1, (PM2, PM3)h, PM4) with (PM2, PM3)h being the revisiting process and h≧2, the method comprising:
A non-transitory computer-readable medium whose contents cause a computing system to perform a computer-implemented method for scheduling a cluster tool, the cluster tool comprising a single-arm robot for wafer handling, a wafer-processing system comprising four process modules including PM1, PM2, PM3, and PM4, each for performing a wafer-processing step with a wafer residency time constraint where the ith process module, iε{1, 2, . . . 4}, is used for performing Step i of the wafer-processing steps for each wafer, and a wafer flow pattern having (PM1, (PM2, PM3)h, PM4) with (PM2, PM3)h being the revisiting process and h≧2, the method comprising:
Dependencies are inferred from the claim text.