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US 2017/0076842 A1Published application
Chip component and method of producing the same
AssigneeRohm Co., Ltd.
InventorsYasuhiro KONDO, Hiroshi TAMAGAWA, Hiroki YAMAMOTO
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Abstract
A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
Claims11
A chip resistor, comprising:
- a substrate;
- a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film;
- an electrode provided on the substrate;
- and
- a plurality of fuses disconnectably connecting the resistor elements to the electrode, wherein
- the resistive film is made of at least one material selected from the group consisting of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.
3 more elements
Dependencies are inferred from the claim text.