US 2017/0048987 A1 · SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF

Abstract

The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

Claims6

Dependent claims

A production process of substrate for suspension comprising:

a metal supporting substrate,
an insulating layer formed on the metal supporting substrate,
a wiring layer formed on the insulating layer,
a cover layer formed to cover the wiring layer,
a first structural part including the metal supporting substrate, the insulating layer, the wiring layer, and the cover layer, and
a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate,
the method comprises a step of:
forming at least one of the insulating layer and the cover layer such that at least one of a width from an edge of the wiring layer to an edge of the insulating layer and a width from the edge of the wiring layer to an edge of the cover layer is locally large in planar view at a boundary region between the first structural part and the second structural part.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/338,860Filed 31 Oct 2016

Priority

JP 2010-14752629 Jun 2010

Published

16 Feb 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification19 codes

H05K 3/4644
Manufacturing multilayer circuits: by building the multilayer layer by layer, i.e. build-up multilayer circuits
G11B 5/48
Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor: disposition or…
G11B 5/4826
Specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives: mounting, aligning or attachment of…
G11B 5/4833
Specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives: structure of the arm assembly, e.g.…

Family

Application13/171,662Division · filed 29 Jun 2011

Application14/278,490Division · filed 15 May 2014

Application15/338,860Division

US 2011/0318609 A1Published application

US 2014/0246224 A1Published application

US 8,758,910 B2Related patent

US 9,516,747 B2Related patent

US 2017/0048987 A1This patent

From the US filing history. Foreign family members aren’t listed.

Substrate for suspension, and production process thereof

Life of this patent

Substrate for suspension, and production process thereof

Life of this patent

Abstract

Claims6