Securing mechanism and method for wafer bonder

An apparatus for bonding a wafer to a plate, the apparatus comprising:

• a base member having a platform surface dimensioned to receive thereon a wafer and a plate that are configured to be bonded;
• a lid pivotally coupled to the base member by a hinge, the lid being pivotable between a closed position adjacent the base member and an open position apart from the base member, where in the closed position the wafer and plate are interposed between the platform surface of the base member and a contact surface of the lid, where the open position facilitates the positioning of the wafer and the plate on the base member prior to bonding and facilitates the removal of the bonded assembly of wafer and plate from the base member after completion of bonding;
• and
• a clamp mechanism configured to engage and apply a force onto a side of the lid opposite the contact surface when in the closed position to thereby push the lid against the base member.

An apparatus for bonding a wafer to a plate, the apparatus comprising:

• a lower member having a platform surface configured to receive thereon a wafer and a plate;
• an upper member pivotally coupled to the lower member by a hinge and pivotable between a closed position adjacent the lower member and an open position apart from the lower member, where in the closed position the wafer and plate are interposed between the platform surface of the lower member and a pneumatic diaphragm of the upper member, the diaphragm configured to apply a bonding force to the wafer and the plate when the upper member is in the closed position;
• and
• a clamp mechanism configured to engage and apply a force onto a side of the upper member opposite the diaphragm when in the closed position to thereby push the upper member against the lower member.