Multi-stacked electronic device with defect-free solder connection

A method of forming an electronic structure, comprising:

• providing a first electronic component, the first electronic component comprising a lateral, outside, downwardly extending, first leadframe;
• providing a second electronic component, the second electronic component comprising a lateral, upwardly extending second leadframe;
• placing the first electronic component above and in close proximity with the second electronic component to form a stacked electronic device, wherein the second leadframe extends upwardly, laterally inside of, and vertically overlapping with, the first lead frame, wherein the first and second leadframes include vertically overlapping portions in a contact region, and the first leadframe includes a lower portion spaced from said overlapping portions and defining a solder connection region;
• joining the first leadframe of the first electronic component to the second leadframe of the second electronic component using a non-solder metal joining process to form a joint in the contact region directly between and physically joining together the overlapping portions of the first and second leadfraames, wherein the joint is located outside the solder connection region;
• and
• using a soldering process to form a solder connection in the solder connection region, below and spaced from the joint, to solder the stacked electronic device to a soldering surface, the solder connection including a solder material having a melting point lower than a melting point of the joint.

A method of forming an electronic structure, comprising:

• forming a stacked electronic device comprised of first and second electronic components, the first electronic component comprising a lateral, outside, downwardly extending, first leadframe, and the second electronic component comprising a lateral, upwardly extending second leadframe, including
• placing the first electronic component above and in close proximity with the second electronic component to form the stacked electronic device, wherein the second leadframe extends upwardly, laterally inside of, and vertically overlapping with, the first lead frame, wherein the first and second leadframes include vertically overlapping portions in a contact region, and the first leadframe includes a lower portion spaced from said overlapping portions and defining a solder connection region;
• and
• joining the first leadframe of the first electronic component to the second leadframe of the second electronic component using a non-solder metal joining process to form a joint in the contact region directly between and physically joining together the overlapping portions of the first and second leadfraames, wherein the joint is located outside the solder connection region;
• and
• using a soldering process to form a solder connection in the solder connection region, to solder the stacked electronic device to a soldering surface, the solder connection including a solder material having a melting point lower than a melting point of the joint, and wherein the solder connection is below and spaced from the joint, is beneath the leadframe of the second electronic component, and extends laterally inward of the first and second leadframes.