Depositing bulk or micro-scale electrodes
AssigneeLawrence Livermore National Security, LLC
InventorsKedar G. Shah, Satinderpall S. Pannu, Vanessa Tolosa, Angela C. Tooker, Heeral J. Sheth, Sarah H. Felix, Terri L. Delima
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Abstract
Thicker electrodes are provided on microelectronic device using thermo-compression bonding. A thin-film electrical conducting layer forms electrical conduits and bulk depositing provides an electrode layer on the thin-film electrical conducting layer. An insulating polymer layer encapsulates the electrically thin-film electrical conducting layer and the electrode layer. Some of the insulating layer is removed to expose the electrode layer.
Claims18
A method of fabricating or depositing electrode materials, comprising the steps of:
- depositing an electrically insulating polymer layer on a substrate,
- depositing a thin-film electrical conducting layer to form electrical conduits connecting,
- bulk depositing an electrode layer on said thin-film electrical conducting layer,
- depositing an encapsulating electrically insulating polymer layer on said thin-film electrical conducting layer and said electrode layer,
- removing some of said insulating layer covering said electrode layer, and
- releasing the electrode materials from said substrate.
A microelectrode device, comprising:
- a device body having an underlying electrically insulating layer,
- a conductive thin-film layer on said underlying electrically insulating layer,
- at least one electrode embedded in said electrically insulating layer wherein said at least one electrode is a bulk deposited electrode, and
- at least one electrically conducting lead coupled to said at least one electrode.
Dependencies are inferred from the claim text.