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US 2017/0013339 A1Published application
Microphone sensor
AssigneeHyundai Motor Company
InventorsHyunsoo Kim, Ilseon Yoo
Life of this patent
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Abstract
A microphone sensor provides, a receiving space disposed on a cover and a control module and positioned with a sound sensing module in the receiving space. The microphone sensor includes a cover having a receiving groove formed at a lower portion and an air inlet that a sound signal flow in through within a control module coupled to the lower portion of the cover. Furthermore, a sound sensing module is coupled to the control module and positioned at the receiving groove.
Claims17
A microphone sensor, comprising:
- a cover including a receiving groove formed at a lower portion and an air inlet that inflows a sound signal;
- a control module coupled to the lower portion of the cover;
- and
- a sound sensing module coupled to the control module and positioned at the receiving groove.
1 more element
A microphone sensor, comprising:
- a control module including a receiving groove formed at a first side of the control module;
- a cover that covers the receiving groove and coupled to the first side of the control module;
- and
- a sound sensing module positioned at the receiving groove.
1 more element
Dependencies are inferred from the claim text.