Piezoelectric device, liquid ejection head, and method of manufacturing piezoelectric device
AssigneeSeiko Epson Corporation
InventorMotoki TAKABE
Life of this patent
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Abstract
A piezoelectric device includes a first substrate having an empty chamber, a diaphragm defining a surface of the empty chamber, a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in sequence from the diaphragm side, the piezoelectric element provided on the side of the diaphragm opposite to the empty chamber, and a second substrate provided on the side of the first substrate opposite to the diaphragm. The thickness of at least a part of the first substrate in an opening peripheral area of the empty chamber is thicker than the thickness in an area outside the opening peripheral area.
Claims8
A piezoelectric device comprising:
- a first substrate having an empty chamber;
- a diaphragm defining a surface of the empty chamber;
- a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in sequence from the diaphragm side, the piezoelectric element provided on the side of the diaphragm opposite to the empty chamber;
- and
- a second substrate provided on the side of the first substrate opposite to the diaphragm,
- wherein the thickness of at least a part of the first substrate in an opening peripheral area of the empty chamber is thicker than the thickness in an area outside the opening peripheral area.
A piezoelectric device comprising:
- a first substrate having an empty chamber;
- a diaphragm defining a surface of the empty chamber;
- a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in sequence from the diaphragm side, the piezoelectric element provided on the side of the diaphragm opposite to the empty chamber;
- and
- a second substrate provided on the side of the first substrate opposite to the diaphragm,
- wherein the thickness of at least a part of the first substrate is gradually increased toward the empty chamber.
A method of manufacturing a piezoelectric device including:
- a first substrate having an empty chamber;
- a diaphragm defining a surface of the empty chamber;
- a piezoelectric element formed by stacking a first electrode layer, a piezoelectric layer, and a second electrode layer in sequence from the diaphragm side, the piezoelectric element provided on the side of the diaphragm opposite to the empty chamber;
- and
- a second substrate provided on the side of the first substrate opposite to the diaphragm, the method comprising:
- forming the piezoelectric element on a side to be the diaphragm of a substrate including the first substrate and the diaphragm;
- polishing the substrate on the side opposite to the piezoelectric element while an area other than the piezoelectric element on the substrate is being pressed from the side of the piezoelectric element in the thickness direction such that the thickness of the substrate in an area not pressed becomes thicker than the thickness of the substrate in the pressed area;
- forming the empty chamber in the area where the polished substrate is thicker, the area corresponding to the piezoelectric element such that the substrate includes the first substrate and the diaphragm;
- and
- bonding the second substrate to the side of the first substrate opposite to the piezoelectric element.
Dependencies are inferred from the claim text.