Method and device for embossing of a nanostructure
AssigneeEV Group E. Thallner GmbH
InventorGerald Kreindl
Life of this patent
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Abstract
A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
Claims12
1-8. (canceled)
A method for embossing a nanostructure that is formed on a nanostructure punch into a punch surface of a curable material which has been applied to a substrate, the method comprising:
- aligning the nanostructure relative to the punch surface,
- embossing the punch surface with the nanostructure by
- A) prestressing the nanostructure punch by deforming the nanostructure punch,
- B) contacting a partial area of the punch surface with the nanostructure punch, and
- C) releasing the nanostructure punch and thereby automatically contacting a remaining surface of the punch surface at least partially by the prestressing of the nanostructure punch.
A device for embossing of a nanostructure formed on a nanostructure punch into a punch surface of a curable material which has been applied to a substrate, the device comprising:
- alignment means for aligning the nanostructure relative to the punch surface, and
- an embossing apparatus for embossing of the punch surface, the embossing apparatus including:
- A) first prestressing means for prestressing the nanostructure punch by deformation of the nanostructure punch,
- B) contact-making means for contacting a partial area of the punch surface with the nanostructure punch, and
- C) means for automatic contacting for contacting a remaining surface of the punch surface by releasing the nanostructure punch and at least partially by the prestressing of the nanostructure punch.
Dependencies are inferred from the claim text.