Method and apparatus for treating substrate
AssigneeSemes Co., Ltd.
InventorTAEKYOUB LEE
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Abstract
Disclosed is a method for treating a substrate, the method including a pre-wetting operation of discharging pure water onto an upper surface of the substrate, and a treatment operation of treating the substrate by supplying a treatment liquid onto the upper substrate, after the pre-wetting operation, wherein the method further includes a static electricity removing operation of removing static electricity by discharging a static electricity removing liquid onto a lower surface of the substrate, before the treatment operation.
Claims21
A method for treating a substrate, the method comprising:
- a pre-wetting operation of discharging pure water onto an upper surface of the substrate;
- and
- a treatment operation of treating the substrate by supplying a treatment liquid onto the upper substrate, after the pre-wetting operation,
- wherein the method further comprises a static electricity removing operation of removing static electricity by discharging a static electricity removing liquid onto a lower surface of the substrate, before the treatment operation.
An apparatus for treating a substrate, the apparatus comprising:
- a support unit that supports the substrate;
- an injection unit having a pure water injection member that discharges pure water onto an upper surface of the substrate and a treatment liquid injection member that supplies a treatment liquid onto the upper surface of the substrate;
- a back nozzle unit that injects a static electricity removing liquid onto a lower surface of the substrate;
- and
- a controller that controls the injection unit and the back nozzle unit,
- wherein the controller controls the injection unit and the back nozzle unit such that the treatment liquid injection member supplies a treatment liquid onto the upper surface of the substrate after the pure water injection member discharges the pure water onto the upper surface of the substrate and the back nozzle unit discharges the static electricity removing liquid onto the lower surface of the substrate before the treatment liquid is supplied.
The apparatus of clam 12, wherein the treatment liquid is a conductive liquid.
The apparatus of clam 12, wherein the injection unit further comprises:
- a gas injecting member that supplies a drying gas onto the upper surface of the substrate, and
- wherein the controller controls the injection unit such that the gas injection member injects a gas onto the upper surface of the substrate after the injection unit supplies the treatment liquid onto the substrate.
Dependencies are inferred from the claim text.