Method and apparatus for treating substrate
AssigneeSemes Co., Ltd.
InventorTaekyoub Lee
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Abstract
A method for treating a substrate with a treatment liquid is disclosed, wherein the substrate is treated while a location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein the movement distances of some of the plurality of movements are different from each other.
Claims23
A method for treating a substrate with a treatment liquid, wherein the substrate is treated while a supply location at which the treatment liquid is supplied onto the substrate that is rotated is moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate or in an inward direction from a peripheral area of the substrate towards a central area of the substrate a plurality of times, and wherein movement distances of some of the plurality of movements are different from each other.
A method for treating a substrate with a treatment liquid, wherein the treatment liquid is supplied to the substrate that is rotated, while being alternately moved in an outward direction from a central area of the substrate towards a peripheral area of the substrate and an inward direction from a peripheral area of the substrate towards a central area of the substrate, wherein a process condition for treating the substrate varies while the treatment liquid is supplied, and wherein the process condition comprises at least one of an interval between a nozzle that supplies the treatment liquid and the substrate, a discharge amount of the treatment liquid, a rotational speed of the substrate, and a movement speed of the nozzle according to a supply location of the treatment liquid.
Dependencies are inferred from the claim text.