Systems and methods to dispense and mix reagents
AssigneeCentrillion Technology Holdings Corporation
InventorsFilip CRNOGORAC, Glenn MCGALL, Bolan LI
Life of this patent
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Abstract
The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.
Claims20
A wafer processing apparatus comprising:
- a wafer conveyance robot configured to move a first wafer from a first position to a second position;
- a vacuum chuck at the second position, the vacuum chuck rotatably holding the first wafer;
- a lid dispenser at the second position, the lid dispenser aligned with the first wafer along a vertical axis;
- a nozzle provided by the lid dispenser and above the first wafer, the nozzle dispensing at least one reagent onto a surface of the first wafer;
- wherein the vacuum chuck is configured to rotate the first wafer to spread the at least one reagent over the surface of the first wafer by centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent.
A method for processing wafers, comprising:
- (a) providing a first wafer;
- (b) moving the first wafer from a first position to a second position by a wafer conveyance robot;
- (c) placing the first wafer on top of a vacuum chuck at the second position, the vacuum chuck rotatably holding the first wafer;
- and
- (d) dispensing at least one reagent onto a surface of the first wafer by a nozzle in a lid dispenser at the second position when the wafer is stationary;
- wherein the nozzle is placed above the first wafer and projected at the center of the wafer, and wherein the vacuum chuck is configured to rotate the first wafer to mix the at least one reagent with an additional reagent over the surface of the first wafer.
Dependencies are inferred from the claim text.